Type | Description |
|---|---|
Category | Connectors, Interconnects Arrays, Edge Type, Mezzanine (Board to Board) |
Manufacturer |
Hirose Electric Co Ltd |
Series |
BM23 |
Packaging |
Tape & Reel (TR) |
Part Status |
Active |
Connector Type |
Header, Outer Shroud Contacts |
Number of Positions |
10 |
Pitch |
0.014" (0.35mm) |
Number of Rows |
2 |
Mounting Type |
Surface Mount |
Features |
Solder Retention |
Contact Finish |
Gold |
Contact Finish Thickness |
1.97µin (0.050µm) |
Mated Stacking Heights |
0.8mm |
Height Above Board |
0.025" (0.63mm) |
Base Product Number |
BM23PF0.8 |
