Type | Description |
|---|---|
Category | Connectors, Interconnects Contacts, Spring Loaded (Pogo Pins), and Pressure |
Manufacturer |
CUI Devices |
Series |
CPG |
Packaging |
Bag |
Part Status |
Active |
Contact Type |
Contact Pad |
Mounting Type |
Surface Mount |
Maximum Working Height |
- |
Recommended Working Height |
- |
Minimum Working Height |
- |
Pad Layout Dimension |
Circular - 0.059" (1.50mm) Dia, 0.061" (1.55mm) H |
Operating Force - Initial |
- |
Operating Force - Mid Compression |
- |
Plunger Size |
- |
Features |
- |
Mating Cycles |
- |
Contact Material |
Brass Alloy |
Contact Finish |
Gold |
Contact Finish Thickness |
20.0µin (0.51µm) |
Current Rating (Amps) |
- |
Material Flammability Rating |
- |
Operating Temperature |
- |
