Type | Description |
|---|---|
Category | Connectors, Interconnects IC Sockets |
Manufacturer |
Aries Electronics |
Series |
55 |
Packaging |
Bulk |
Part Status |
Active |
Type |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid) |
28 (2 x 14) |
Pitch - Mating |
0.100" (2.54mm) |
Contact Finish - Mating |
Tin |
Contact Finish Thickness - Mating |
200.0µin (5.08µm) |
Contact Material - Mating |
Beryllium Copper |
Mounting Type |
Through Hole |
Features |
Closed Frame |
Termination |
Solder |
Pitch - Post |
0.100" (2.54mm) |
Contact Finish - Post |
Tin |
Contact Finish Thickness - Post |
200.0µin (5.08µm) |
Contact Material - Post |
Beryllium Copper |
Housing Material |
Polyphenylene Sulfide (PPS), Glass Filled |
Operating Temperature |
- |
Termination Post Length |
0.110" (2.78mm) |
Material Flammability Rating |
UL94 V-0 |
Current Rating (Amps) |
1 A |
Contact Resistance |
- |
Base Product Number |
28-6554 |
