Type | Description |
|---|---|
Category | Connectors, Interconnects IC Sockets |
Manufacturer |
3M |
Series |
Textool™ |
Packaging |
Bulk |
Part Status |
Active |
Type |
PGA, ZIF (ZIP) |
Number of Positions or Pins (Grid) |
200 (21 x 21) |
Pitch - Mating |
0.100" (2.54mm) |
Contact Finish - Mating |
Gold |
Contact Finish Thickness - Mating |
30.0µin (0.76µm) |
Contact Material - Mating |
Beryllium Copper |
Mounting Type |
Through Hole |
Features |
Closed Frame |
Termination |
Solder |
Pitch - Post |
0.100" (2.54mm) |
Contact Finish - Post |
Gold |
Contact Finish Thickness - Post |
30.0µin (0.76µm) |
Contact Material - Post |
Beryllium Copper |
Housing Material |
Polyethersulfone (PES) |
Operating Temperature |
-55°C ~ 150°C |
Termination Post Length |
1.701" (43.20mm) |
Material Flammability Rating |
UL94 V-0 |
Current Rating (Amps) |
1 A |
Contact Resistance |
- |
