Type | Description |
|---|---|
Category | Connectors, Interconnects Arrays, Edge Type, Mezzanine (Board to Board) |
Manufacturer |
Samtec Inc. |
Series |
SEARAY™ SEAFP |
Packaging |
Tray |
Part Status |
Active |
Connector Type |
High Density Array, Female |
Number of Positions |
400 |
Pitch |
0.050" (1.27mm) |
Number of Rows |
8 |
Mounting Type |
Through Hole, Right Angle, Press-Fit |
Features |
Solder Retention |
Contact Finish |
Gold |
Contact Finish Thickness |
30.0µin (0.76µm) |
Mated Stacking Heights |
- |
Height Above Board |
- |
Base Product Number |
SEAFP-50 |
