Type | Description |
|---|---|
Category | Connectors, Interconnects Arrays, Edge Type, Mezzanine (Board to Board) |
Manufacturer |
Amphenol ICC (FCI) |
Series |
DensiStak™ |
Packaging |
Tape & Reel (TR) |
Part Status |
Active |
Connector Type |
Header, Center Strip Contacts |
Number of Positions |
220 |
Pitch |
0.031" (0.80mm) |
Number of Rows |
11 |
Mounting Type |
Surface Mount |
Features |
Board Guide, Pick and ce, Solder Retention |
Contact Finish |
Gold |
Contact Finish Thickness |
3.00µin (0.076µm) |
Mated Stacking Heights |
8mm |
Height Above Board |
0.276" (7.01mm) |
